CN 41-1243/TG ISSN 1006-852X
Volume 44 Issue 2
Apr.  2024
Turn off MathJax
Article Contents
LIU Yisheng, HUANG Hui, WANG Lanqing, LIAO Xinjiang. Experimental study on normal force of cutting sapphire with multi-wire swing reciprocating wire saw[J]. Diamond & Abrasives Engineering, 2024, 44(2): 143-150. doi: 10.13394/j.cnki.jgszz.2023.0039
Citation: LIU Yisheng, HUANG Hui, WANG Lanqing, LIAO Xinjiang. Experimental study on normal force of cutting sapphire with multi-wire swing reciprocating wire saw[J]. Diamond & Abrasives Engineering, 2024, 44(2): 143-150. doi: 10.13394/j.cnki.jgszz.2023.0039

Experimental study on normal force of cutting sapphire with multi-wire swing reciprocating wire saw

doi: 10.13394/j.cnki.jgszz.2023.0039
More Information
  • Received Date: 2023-02-24
  • Accepted Date: 2023-06-27
  • Rev Recd Date: 2023-06-24
  • Available Online: 2023-11-06
  • Multi-wire swing reciprocating sawing technology is the main machining method used to cut sapphire crystal bars into wafer substrates, while normal force is an important index that reflects the processing stability. In this paper, the normal force (Fn) during multi-wire swing reciprocating wire saw cutting sapphire crystal bars was measured, and the change in normal force at different positions and cutting depths of the sapphire crystal bars was tracked. The influence of various process parameters on the stability of the machining process was tracked by using the rangeability of normal force Fn as the index. The experimental results show that Fn is closely correlated with the reciprocating motion of the wire saw and the rocking motion of the workpiece, and ΔFn in the front of the sapphire crystal bar is significantly different from that in the middle and back. Process parameters such as the wire saw speed(vs), maximum swing angle (θmax), single piece wire consumption (Md), tensioning force (Fw), and total cutting time (T) have different effects on ΔFn. The fluctuation degree of ΔFn is closely related to the wear of the wire saw.


  • loading
  • [1]
    WU H. Wire sawing technology a state-of-the-art review [J]. Precision Engineering,2016,(43:1-9. doi: 10.1016/j.precisioneng.2015.08.008
    高航, 孔维邈. 脆性材料用固结金刚石线锯切割技术研究进展 [J]. 金刚石与磨料磨具工程,2019,39(4):97-102.

    GAO Hang, KONG Weimiao. Development of consolidated diamond wire saw cutting technology for brittle materials [J]. Diamond & Abrasives Engineering,2019,39(4):97-102.
    ANSPACH O, HURKA B, SUNDER K. Structured wire: From single wire experiments to multi-crystalline silicon wafer mass production [J]. Solar Energy Materials and Solar Cells,2014(131):58-63. doi: 10.1016/j.solmat.2014.06.008
    张强. 固结磨料多线切割设备的设计与研究 [D]. 苏州: 苏州大学, 2019.

    ZHANG Qiang. Design and Research of Fixed Abrasive Multi-wire Cutting Equipment [D]. Suzhou: Soochow University, 2019.
    LIU Y H, GAO Y F, YANG C F. Analysis of sawing characteristics of fine diamond wire slicing multicrystalline silicon [J]. Diamond and Related Materials,2021(48):17335-17342.
    GE M R, CHEN Z B, WANG P Z, et al. Crack damage control for diamond wire sawing of silicon the selection of processing parameters [J]. Materials Science in Semiconductor Processing,2022,148:106838-106846. doi: 10.1016/j.mssp.2022.106838
    LIU Y H, ZHU Z F. Experimental investigation on diamond wire sawing of Si3N4 ceramics considering the evolution of wire cutting performance [J]. Ceramics International,2022(48):17335-17342. doi: 10.1016/j.ceramint.2022.02.296
    HUANG H, LI X X, XU X P. An Experimental research on the force and energy during the sapphire sawing using reciprocating electroplated diamond wire saw [J]. ASME International,2017,139(12):121011-121015.
    COSTA E C, WEINGAERTNER W L, XAVIER F A. Influence of single diamond wire sawing of photovoltaic monocrystalline silicon on the feed force, surface roughness and micro-crack depth [J]. Materials Science in Semiconductor Processing,2022(143):106525-106535. doi: 10.1016/j.mssp.2022.106525
    WANG P Z, GE P Q, GAO Y F, et al. Prediction of sawing force for single-crystal silicon carbide with fixed abrasive diamond wire saw [J]. Materials Science in Semiconductor Processing,2017(63):25-32. doi: 10.1016/j.mssp.2017.01.014
    WANG P Z, GE P Q, LI Z Q, et al. A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC [J]. Materials Science in Semiconductor Processing,2017(68):21-29. doi: 10.1016/j.mssp.2017.05.032
    WANG Y, ZHANG S, DONG G J, et al. Theoretical study on sawing force of ultrasonic vibration assisted diamond wire sawing (UAWS) based on abrasives wear [J]. Wear,2022(496/497):204291-204301.
    WANG Y, LI D L, DING Z J, et al. Modeling and verifying of sawing force in ultrasonic vibration assisted diamond wire sawing (UAWS) based on impact load [J]. International Journal of Mechanical Sciences,2019(164):105161-105170. doi: 10.1016/j.ijmecsci.2019.105161
    李茜茜. 线锯切割光电材料的锯切力及锯切质量的试验研究[D]. 厦门: 华侨大学, 2017.

    LI Xixi. Experimental study on force and surface quality of photoelectric material with fixed abrasive diamond wire [D]. Xiamen: Huaqiao University, 2017.
    麻磊. 金刚石线锯切割力的分析与控制研究[D]. 西安: 西安理工大学, 2017.

    MA Lei. Study on cutting force analysis and control of diamond wire saw [D]. Xi’an: Xi’an University of Technology, 2017.
    纪磊磊. 固结金刚石磨粒线锯振动对切片表面形貌影响的研究[D]. 西安: 西安理工大学, 2018.

    JI Leilei. Study on effect of vibration of fixed diamond A-Brasive grain saw on surface morphology of slice[D]. Xi’an: Xi’an University of Technology, 2018.
    KIM H, KIM D, KIM C, et al. Multi-wire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires [J]. CIRP Annals-Manufacturing Technology,2013(62):335-338. doi: 10.1016/j.cirp.2013.03.122
    KIM D, KIM H, LEE S, et al. Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw [J]. Springer Science and Business Media LLC,2015(2):117-121.
    KAO I, PRASAD V, LI J, et al. Wafer slicing and wire saw manufacturing technology[C]// Proceedings of the 1997 NSF Design & Manufacturing Grantees Conference. Washington: University of Washington, 1997: 239-240.
    杨沁. 多线摇摆往复式线锯切割大尺寸单晶碳化硅的试验研究 [D]. 厦门: 华侨大学, 2020.

    YANG Qin. Experimental study on cutting large-size single-crystalline silicon carbide with multi-wire swing reciprocating wire saw [D]. Xiamen: Huaqiao University, 2020.
    杨沁, 黄辉, 郑生龙. 多线摇摆往复式线锯切割加工运动的理论及试验研究 [J]. 机械工程学报,2020,56(11):219-228. doi: 10.3901/JME.2020.11.219

    YANG Qin, HUANG Hui, ZHENG Shenglong. Theoretical and experimental research on machining movement of multi-wire sawing with rocking and reciprocating [J]. Journal of Mechanical Engineering,2020,56(11):219-228. doi: 10.3901/JME.2020.11.219
    YANG Z X, HUANG H, LIAO X J. Influence of cutting parameters on wear of diamond wire during multi-wire rocking sawing with reciprocating motion [J]. Frontiers in Mechanical Engineering,2022(8):1-12.
    王兰青. 多线摇摆往复式线锯切割蓝宝石的晶片质量及锯切力试验研究[D]. 厦门: 华侨大学, 2021.

    WANG Lanqing. Experimental research on sapphire wafer quality and cutting force in multi-wire swing reciprocating wire saw cutting[D]. Xiamen: Huaqiao University, 2021.
  • 加载中


    通讯作者: 陈斌,
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索

    Figures(13)  / Tables(1)

    Article Metrics

    Article views (456) PDF downloads(132) Cited by()
    Proportional views


    DownLoad:  Full-Size Img  PowerPoint