Abstract: High efficiency and low damage lapping of zirconia ceramic back is the precondition of its applications in 5 Gcommunication.The hard and brittle characteristics of zirconia materials caused serious wear of abrasive particles, so the diamond aggregation abrasives were chosen to prepare the fixed abrasive pad (FAP).A comparison of lapping performance between diamond aggregation FAP and single diamond FAP was made.The role of SiC particles in the slurry in the self-dressing process of FAP was explored.Resultsshow that using diamond aggregation pad assisted by silicon carbide slurry, can obviously improve the lapping speed and the surface machining quality.When adopting the grain size of diamond aggregation in FAP is 230/270 and the slurry with particle size of green SiC is from 3 to 5 μm, the material removal rate of zirconia ceramic can reach more than 2.5 μm/min with average surface roughness R_a is 74.9 nm.