超声辅助螺旋磨削SiC<sub>f</sub>/SiC陶瓷基复合材料

张海涛; 鲍岩; 杨峰; 孙海琦; 董志刚; 康仁科

doi:10.13394/j.cnki.jgszz.2021.0107

超声辅助螺旋磨削SiC_f/SiC陶瓷基复合材料

doi: 10.13394/j.cnki.jgszz.2021.0107

大连理工大学，精密与特种加工教育部重点实验室，辽宁大连 116024

基金项目: 基础**课题(2020-****-ZD-176)；中国博士后科学基金资助(2020T130076)

详细信息

通讯作者:
康仁科，男，1962年生，教授。主要研究方向：精密与超精密加工、特种加工等。E-mail: kangrk@dlut.edu.cn

中图分类号: TG58;TQ164
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出版历程
- 收稿日期: 2021-10-12
- 修回日期: 2021-12-02
- 录用日期: 2021-12-20
- 网络出版日期: 2022-03-17
- 刊出日期: 2022-03-17

Ultrasonic assisted helical grinding of SiC_f/SiC ceramic matrix composites

Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, Liaoning, China

摘要

摘要: 针对SiC纤维增强SiC陶瓷基复合材料(SiC_f/SiC)存在加工质量差、材料去除困难等问题，开展金刚石砂轮超声辅助螺旋磨削SiC_f/SiC陶瓷基复合材料试验，研究其出口质量、孔壁形貌及孔壁表面粗糙度。结果表明：与传统制孔相比，超声辅助螺旋磨削制孔出口处材料无大面积崩边;砂轮磨削速度方向与纤维方向的夹角θ的周期性变化导致孔壁表面形貌呈现规律性变化。当θ在0°/180°时，纤维与基体多发生脱黏现象；当θ在45°时，纤维多发生剪切断裂；当θ在90°时，纤维多发生挤压断裂；当θ在135°时，纤维既发生剪切断裂又发生挤压断裂；孔壁表面粗糙度S_a在θ为90°时最低，在θ为135°时最高。在一定范围内，表面粗糙度S_a随着超声振幅的增大而降低，最大降幅为38.7%；随着进给速度的增大而升高，最大增幅为39.3%。
- SiC_f/SiC陶瓷基复合材料 /
- 超声辅助螺旋磨削 /
- 孔壁质量 /
- 材料去除机理
Abstract: SiC fiber reinforced SiC ceramic matrix composites (SiC_f/SiC) have problems such as poor machining quality and difficult material removal. To study these problems, SiC_f/SiC composites were processed by ultrasonic-assisted helical grinding. The exit quality of hole, hole wall morphology and three-dimensional surface roughness of hole wall were explored. The results show that compared with traditional hole making, the material at the exit of the hole made by ultrasonic-assisted helical grinding has no large area chipping. The periodic change of the angle θ between the direction of the cutting speed of the grinding wheel and the fiber direction leads to regular changes in the surface morphology of the hole wall. When θ is 0°/180°, the fiber and the matrix are debonded. When θ is 45°, the fiber is sheared and fractured. When θ is 90°, the fiber is crushed and fractured. When θ is 135°, the fiber has both shear fracture and extrusion fracture. The hole wall surface roughness S_a is the lowest value when θ is 90°, and S_a is the highest value when θ is 135°. Within a certain range, the surface roughness value S_a decreases with the increase of the ultrasonic amplitude, with a maximum decrease of 38.7%, and increases with the increase of the feed rate, with a maximum increase of 39.3%.
- SiC_f/SiC ceramic matrix composites /
- ultrasonic assisted helical grinding /
- hole wall quality /
- material removal mechanism

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图 1 试验平台

Figure 1. Testing platform

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图 2 超声辅助螺旋磨削制孔原理

Figure 2. Principle of hole making in ultrasonic assisted helical grinding

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图 3 出口形貌

Figure 3. Export morphology

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图 4 砂轮磨削速度方向与纤维方向所成夹角θ

Figure 4. Angle θ between grinding speed direction and fiber direction

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图 5 SiC_f/SiC陶瓷基复合材料制孔孔壁分析

Figure 5. Analysis of hole wall of SiC_f/SiC ceramic matrix composites

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图 6 0° ~ 180°范围内夹角θ对应的材料去除示意图

Figure 6. Schematic diagram of material removal corresponding of angle θ ranging from 0° to 180°

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图 7 孔壁三维形貌及粗糙度

Figure 7. Three-dimensional morphology and roughness of hole wall

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图 8 超声振幅对孔壁粗糙度值的影响

Figure 8. Influence of ultrasonic amplitude on roughness of hole wall

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表 1 试验参数

Table 1. Testing condition

序号	进给速度 v_f /(mm·min⁻¹)	超声振幅 A / μm
1	80	0
2	100	0
3	120	0
4	80	2
5	100	2
6	120	2
7	80	4
8	100	4
9	120	4

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