Magnetic compound fluid polishing of aspheric workpiece under rotating magnetic field
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摘要: 针对非球面光学元件的结构特点及其表面质量要求,在磁性混合流体抛光基础上,设计并制作以径向充磁永磁体为旋转磁场源的半球头抛光头。首先,通过Ansoft Maxwell磁场仿真,分析对比不同形状、不同尺寸磁体和偏心距下各磁体周围磁场的分布状况,选定直径为10.0 mm、高度为5.0 mm、偏心距为2.5 mm、径向充磁的圆柱形磁体。其次,通过观测并比较不同组成、配方和供应量的磁性混合流体在抛光头上的行为,确定磁性混合流体抛光液成分。最后,采用制备的磁性混合流体抛光液及自制的抛光头对非球面PMMA工件进行抛光试验。经过15 min抛光后,PMMA工件表面质量明显改善,其面型精度Rq由0.703 μm下降到2.433 nm,表面粗糙度Ra由0.545 μm下降到1.786 nm,说明研制的抛光头能实现非球面工件的纳米级抛光。Abstract: According to the structural characteristics and the surface quality requirements of aspheric optical elements, a hemispherical head polishing head with radial magnetized permanent magnet as rotating magnetic field source is designed and manufactured on the basis of magnetic compound fluid (MCF) polishing. Firstly, through Ansoft Maxwell magnetic field simulation, the distributions of magnetic field around each magnet with different shapes, sizes and eccentricities are analyzed and compared, and the cylindrical magnet with diameter of 10.0 mm, height of 5.0 mm, eccentricity of 2.5 mm and radial magnetization is selected. Secondly, by observing and comparing the behaviors of MCF with different compositions, formula and supplies on the polishing head, the compositions of MCF polishing slurry is determined. Finally, the aspheric PMMA workpiece is polished with the prepared MCF polishing slurry and the self-made polishing head. After polishing for 15 min, the surface quality of the PMMA workpiece is significantly improved, its surface accuracy Rq is decreased from 0.703 μm to 2.433 nm, and the surface roughness Ra is reduced from 0.545 μm to 1.786 nm, indicating that the developed polishing head can realize the nano-polishing of aspheric workpiece.
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表 1 钕铁硼磁体的性能参数
Table 1. Performance parameters of Nd−Fe−B magnet
参数 型号或取值 磁体型号 N35 剩余磁化强度 Br / T 1.170 0~1.210 0 矫顽力 Hcb / (kA·m−1) ≥868 最大磁能积 (BH)max / (kJ·m−3) 263~287 表 2 4种磁体的尺寸
Table 2. Four magnet sizes
磁体形状 直径
D / mm高度
H / mm其他 轴向充磁圆柱体 10.0 5.0 径向充磁圆柱体 10.0 5.0 轴向充磁环形 10.0 5.0 内径为5.0 mm 轴向充磁半球头 10.0 5.0 轴向长为10.0 mm 表 3 MCF成分表(质量分数)
Table 3. MCF composition table(mass fraction)
编号 CIPs
ω1 / %APs
ω2 / %MF
ω3 / %α−纤维素
ω4 / %MCF1 58 12 30 0 MCF2 58 12 27 3 MCF3 53 12 32 3 MCF4 48 12 37 3 MCF5 43 12 42 3 表 4 抛光工艺参数
Table 4. Polishing process parameters
参数 取值 磁体偏心距 e / mm 2.5 铝外壳转速 nc / (r·min−1) 500 磁体转速 nm / (r·min−1) 1 000 MCF供应量 V / mL 0.7 加工间隙 Δ / mm 1.0 抛光时间 t / min 15 -
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