C/SiC复合材料微孔的电镀金刚石钻头钻削加工

庞继伟; 李升; 郭明波; 王兆辉; 袭建人; 杨晓涛

doi:10.13394/j.cnki.jgszz.2022.0026

C/SiC复合材料微孔的电镀金刚石钻头钻削加工

doi: 10.13394/j.cnki.jgszz.2022.0026

1.
山东职业学院智能制造学院, 济南250104
2.
山东大学机械工程学院, 济南250061
3.
山东大学材料科学与工程学院, 济南250061

基金项目: 山东省高等学校青创人才引育计划–铁道车辆智能检修技术创新团队（2019152）；山东省职业教育技艺技能传承创新平台–智能制造技艺技能传承创新平台（2018035）。

详细信息

作者简介:
庞继伟，男，1974年生，副教授。主要研究方向：硬脆复合材料加工技术、机械CAD/CAM技术。E-mail：2891943913@qq.com

中图分类号: TG58; TQ164; TH162; TB332
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出版历程
- 收稿日期: 2022-03-22
- 修回日期: 2022-08-17
- 录用日期: 2022-09-15
- 刊出日期: 2023-02-20

Drilling of C/SiC composite micro holes with electroplated diamond bits

1.
School of Intelligent Manufacturing, Shandong Polytechnic, Jinan 250104, China
2.
School of Mechanical Engineering, Shandong University, Jinan 250061, China
3.
School of Materials Science & Engineering, Shandong University, Jinan 250061, China

摘要

摘要:
用金刚石基本颗粒尺寸分别为20～30，36～54和63～75 μm，直径在0.280～0.440 mm范围的6种电镀金刚石钻头，钻削三维针刺毡基C/SiC复合材料微孔，测试6种钻头的最佳加工工艺参数，分析工艺参数及金刚石基本颗粒尺寸、钻头直径等对微孔加工质量、加工效率的影响。结果表明：在相同钻削速度条件下，进给速度越低时，加工的微孔质量越好；钻头电镀的金刚石磨粒基本颗粒尺寸越大，其钻削效率越高；在6种钻头中，直径为0.300 mm的基体上电镀63～75 μm的磨粒，直径为0.200 mm的基体上电镀36～54 μm的磨粒，能够获得更优的钻孔性能。
- C/SiC复合材料 /
- 微孔加工 /
- 电镀金刚石钻头 /
- 钻削加工
Abstract:
Six kinds of diamond electroplated bits, whose diameters were 0.280～0.440 mm and the basic particle sizes of diamond were 20～30, 36～54 and 63～75 μm, were used to drill micro holes of three-dimensional needle-punched felt-based C/SiC composite materials. The optimum processing parameters of the six kinds of bits were tested, and the influences of the process parameters, the diamond basic particle size and the bit diameter on the processing quality and efficiency of micro holes were analyzed. The results show that at the same drilling speed, the lower the feed speed is, the better the micro-hole quality is. The larger the basic particle size of electroplated diamond grains on the bit is, the higher the drilling efficiency is. In the six kinds of bits, the better drilling performances can be obtained by electroplating 63～75 μm abrasive particles on 0.300 mm diameter substrate and 36～54 μm abrasive particles on 0.200 mm diameter substrate.
- C/SiC composites /
- micro hole processing /
- diamond electroplated bit /
- drilling

HTML全文

图 1 6#电镀金刚石钻头外观

Figure 1. Appearance of 6# diamond electroplated bit

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图 2 微孔外观图

Figure 2. Appearance drawing of micro holes

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图 3 6#钻头加工的微孔放大图

Figure 3. Enlarged views of micro holes machined with 6# bit

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图 4 6#钻头断裂图

Figure 4. Fracture appearance of 6# bit

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图 5 微孔中残存的断裂的6#钻头

Figure 5. Broken 6# bit remaining in micro hole

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图 6 6#钻头磨损外观

Figure 6. Wear appearance of 6# bit

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图 7 磨粒基本颗粒尺寸对切深的影响

Figure 7. Effects of basic sizes of abrasive particles on single step cutting depths

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图 8 磨粒基本颗粒尺寸对进给速度的影响

Figure 8. Effects of basic sizes of abrasive particles on feed speeds

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图 9 试验中微孔数量与钻头对应图

Figure 9. Corresponding diagram between the number of micropores and the drill bits in the test

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表 1 钻头规格表

Table 1. Specifications of drills

编号	基体直径 D₁ / mm	钻头外径 D₂ / mm	金刚石颗粒基本尺寸 D₃ / μm	金刚石浓度 c / (颗·mm⁻¹)	钻头有效长度 L / mm
1#	0.200	0.283	20～30	230～260	3.5
2#	0.200	0.331	36～54	60～90	3.5
3#	0.200	0.358	63～75	20～40	3.5
4#	0.300	0.386	20～30	360～390	5.5
5#	0.300	0.428	36～54	100～130	5.5
6#	0.300	0.437	63～75	40～60	5.5

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表 2 钻削试验方案

Table 2. Drilling test scheme

编号	钻削速度 v_s / (m·min⁻¹)	进给速度 v_f / (mm·min⁻¹)
1	16.0	2.0
2	11.0	2.0
3	8.0	2.0
4	5.5	2.0
5	4.0	2.0
6	16.0	3.0
7	11.0	3.0
8	8.0	3.0
9	5.5	3.0
10	4.0	3.0
11	16.0	5.0
12	11.0	5.0
13	8.0	5.0
14	5.5	5.0
15	4.0	5.0

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表 3 钻头最佳工艺参数

Table 3. Optimum technological parameters of bits

钻头编号	钻削速度 v_s / (m·min⁻¹)	进给速度 v_f / (mm·min⁻¹)		单步切深 a_p / mm
钻头编号	钻削速度 v_s / (m·min⁻¹)	最佳值	最大允许值	单步切深 a_p / mm
1#	16.0	0.5	1.0	0.01
2#	16.0	2.0	2.5	0.03
3#	16.0	2.0	3.0	0.04
4#	16.0	1.5	2.0	0.02
5#	16.0	2.0	3.0	0.04
6#	16.0	3.0	5.0	0.05

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