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热压烧结温度对SiCp/Al复合材料性能的影响

蔡佳宁 乐晨 樊子民 李鑫 唐明强 赵放

蔡佳宁, 乐晨, 樊子民, 李鑫, 唐明强, 赵放. 热压烧结温度对SiCp/Al复合材料性能的影响[J]. 金刚石与磨料磨具工程, 2023, 43(5): 546-552. doi: 10.13394/j.cnki.jgszz.2022.0105
引用本文: 蔡佳宁, 乐晨, 樊子民, 李鑫, 唐明强, 赵放. 热压烧结温度对SiCp/Al复合材料性能的影响[J]. 金刚石与磨料磨具工程, 2023, 43(5): 546-552. doi: 10.13394/j.cnki.jgszz.2022.0105
CAI Jianing, LE Chen, FAN Zimin, LI Xin, TANG Mingqiang, ZHAO Fang. Influence of hot-pressed sintering temperature on properties of SiCp/Al composites[J]. Diamond & Abrasives Engineering, 2023, 43(5): 546-552. doi: 10.13394/j.cnki.jgszz.2022.0105
Citation: CAI Jianing, LE Chen, FAN Zimin, LI Xin, TANG Mingqiang, ZHAO Fang. Influence of hot-pressed sintering temperature on properties of SiCp/Al composites[J]. Diamond & Abrasives Engineering, 2023, 43(5): 546-552. doi: 10.13394/j.cnki.jgszz.2022.0105

热压烧结温度对SiCp/Al复合材料性能的影响

doi: 10.13394/j.cnki.jgszz.2022.0105
详细信息
    作者简介:

    樊子民,男,1977年生,副教授。主要研究方向:先进陶瓷及复合材料。E-mail:fanzimin@126.com

    通讯作者:

    乐晨,男,1986年生,中级工程师。主要研究方向:金属制粉研究。E-mail: metallc@sina.com

  • 中图分类号: TB333

Influence of hot-pressed sintering temperature on properties of SiCp/Al composites

  • 摘要: 采用热压烧结法制备SiCp/Al复合材料,研究烧结温度对复合材料性能的影响。用X射线衍射、阿基米德排水法、三点弯曲法和扫描电镜分析复合材料样品的物相组成、相对密度、力学性能及微观形貌,并测定其热导率和热膨胀系数。结果表明: SiCp/Al复合材料由SiC、Al和Mg2Si相组成,加入Mg提高了基体和SiC颗粒之间的浸润性。随着烧结温度升高,复合材料的硬度和抗弯强度先增加后下降,在700 ℃时达到最大值98 HRB和275 MPa;复合材料的热导率先增加后下降,热膨胀系数先下降后增加,在700 ℃时分别达到最大值218.187 W/(m·K)和最小值8.6 × 10−6 K−1

     

  • 图  1  原料扫描电镜形貌

    (a) SiC-1 (b) SiC-2 (c)铝粉 Aluminum powder (d)硅粉 Silicon powder(e)镁铝合金粉末 Magnesium aluminum alloy powder

    Figure  1.  SEM morphology of raw materials

    图  2  不同温度下烧结样品的 XRD图谱

    Figure  2.  XRD spectra of sintered samples at different temperatures

    图  3  不同热压温度下样品的硬度和抗弯强度

    Figure  3.  Hardness and bending strength of samples at different hot pressing temperatures

    图  4  不同温度下烧结样品的热导率和热膨胀系数

    Figure  4.  Thermal conductivity and thermal expansion coefficient of sintered samples at different temperatures

    图  5  不同热压温度下样品的断口形貌:

    Figure  5.  Fracture morphology of samples at different hot pressing temperatures

    (a) 600 ℃ (b) 650 ℃ (c) 700 ℃ (d) 780 ℃ (e) 800 ℃

    表  1  SiC颗粒增强Al的复合材料制备工艺特点

    Table  1.   Preparation process characteristics of SiC particle reinforced Al composites

    制备方法 工艺特点 优点 缺点
    粉末冶金法 工艺设备成熟,但结构复杂 成分自由度宽,
    制得的材料性能及稳定性较好
    烧结不易控制,成本高
    搅拌铸造法 工艺设备简单,成本低廉 可进行批量化工业生产 材料中的缺陷难以解决,
    制品体积分数较低
    压力铸造法 工艺成熟,成本低 生产周期短,可批量生产 工艺难度大
    喷射共沉积法 对设备要求低 工序简单,流程缩短,效率提高,
    一次成形,适用面广
    成本昂贵,过程难控制
    无压自浸渗法 工艺相对简单 不用考虑系统压力,成本低,
    可达到净成形
    基体与增强相的润湿性较差
    热等静压法 工艺相对简单 力学性能好,实用范围广,
    材料利用率高
    封装技术难以掌控
    下载: 导出CSV

    表  2  SiCp/Al复合材料的热性能

    Table  2.   Thermal properties of SiCp/Al composites

    名称 烧结温度
    θ1
    导热率
    $ \lambda $
    W/(m·K)
    热膨胀系数
    l
    K−1
    参考文献
    60vol%SiCp/Al 600 165 5.00 × 10−6 [17]
    50vol%SiCp/6061Al 680 153 8.10 × 10−6 [18]
    60vol%SiCp/Al-5Si-2.5Mg 510 214 9.80 × 10−6 [19]
    (50~70)vol%SiCp/Al 1 100 120~177 (6~10) × 10−6 [20]
    55vol%SiCp/Al (CPS) 200 10.56 × 10−6 [21]
    60vol%SiCp/Al (PCC-AFT) 175 8.00 × 10−6 [21]
    下载: 导出CSV

    表  3  实验原料及参数

    Table  3.   Experimental raw material parameters

    原料 体积分数
    φ
    %
    D10
    μm
    D50
    μm
    D90
    μm
    氧含量
    ωo
    %
    碳含量
    ωc
    %
    硫含量
    ωs
    %
    密度
    ρ1
    g/cm3
    松装密度
    ρ2
    g/cm3
    振实密度
    ρ3
    g/cm3
    SiC-1 32 8.59 14.22 22.86 0.260 10.79 0.005 3.20 1.19 1.40
    SiC-2 32 59.31 94.95 148.90 0.310 8.46 0.005 3.20 1.71 1.70
    Al粉 14 10.61 17.10 27.49 0.350 0.16 0.005 2.70 1.15 1.50
    镁铝合金粉 20 11.98 32.34 70.55 0.009 0.35 0.003 2.20 0.63 1.08
    硅粉 2 2.15 12.86 63.64 0.460 0.03 0.003 2.34 0.44 0.90
    下载: 导出CSV

    表  4  样品相对密度与温度的关系

    Table  4.   Relationship between relative density and temperature of samples

    温度
    θ2 / ℃
    理论密度
    ρ / (g·cm−3
    实测密度
    ρ /(g·cm−3
    相对密度
    ρ相对 / %
    600 2.93 2.77 94.8
    650 2.93 2.81 96.2
    700 2.93 2.87 98.1
    750 2.93 2.86 97.9
    800 2.93 2.79 95.5
    下载: 导出CSV
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  • 收稿日期:  2022-07-04
  • 修回日期:  2022-09-29
  • 录用日期:  2023-05-31
  • 网络出版日期:  2023-12-07
  • 刊出日期:  2023-10-20

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