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面向SiCf/SiC复合材料精密制孔的单层钎焊金刚石套料钻脉冲激光修整研究

钱宁 何静远 苏宏华 孙雨婷 昂给拉玛 丁文锋 徐九华

钱宁, 何静远, 苏宏华, 孙雨婷, 昂给拉玛, 丁文锋, 徐九华. 面向SiCf/SiC复合材料精密制孔的单层钎焊金刚石套料钻脉冲激光修整研究[J]. 金刚石与磨料磨具工程, 2025, 45(2): 143-152. doi: 10.13394/j.cnki.jgszz.2023.0248
引用本文: 钱宁, 何静远, 苏宏华, 孙雨婷, 昂给拉玛, 丁文锋, 徐九华. 面向SiCf/SiC复合材料精密制孔的单层钎焊金刚石套料钻脉冲激光修整研究[J]. 金刚石与磨料磨具工程, 2025, 45(2): 143-152. doi: 10.13394/j.cnki.jgszz.2023.0248
QIAN Ning, HE Jingyuan, SU Honghua, SUN Yuting, ANGGEI Lama, DING Wenfeng, XU Jiuhua. Precision hole-machining of SiCf/SiC composite using single-layer brazed diamond core drill dressed by pulsed laser[J]. Diamond & Abrasives Engineering, 2025, 45(2): 143-152. doi: 10.13394/j.cnki.jgszz.2023.0248
Citation: QIAN Ning, HE Jingyuan, SU Honghua, SUN Yuting, ANGGEI Lama, DING Wenfeng, XU Jiuhua. Precision hole-machining of SiCf/SiC composite using single-layer brazed diamond core drill dressed by pulsed laser[J]. Diamond & Abrasives Engineering, 2025, 45(2): 143-152. doi: 10.13394/j.cnki.jgszz.2023.0248

面向SiCf/SiC复合材料精密制孔的单层钎焊金刚石套料钻脉冲激光修整研究

doi: 10.13394/j.cnki.jgszz.2023.0248
基金项目: 国家自然科学基金项目(92060203,52205476);航空发动机及燃气轮机基础科学中心项目(P2022-AB-IV-002-001);江苏省科协青年科技人才托举工程项目(TJ-2023-070);南京航空航天大学前瞻布局科研专项重点培育项目(1005-ILB23025-1A);江苏省精密与微细制造技术重点实验室重点项目(1005-ZAA20003-14)。
详细信息
    作者简介:

    通信作者:钱宁,男,1993年生,工学博士,特聘副研究员。主要研究方向:难加工材料高效精密加工技术。E-mail:n.qian@nuaa.edu.cn

  • 中图分类号: TQ164; TG58; TG74

Precision hole-machining of SiCf/SiC composite using single-layer brazed diamond core drill dressed by pulsed laser

  • 摘要: 单层钎焊金刚石套料钻工作面磨粒的出露高度差异大、等高性难以保证,导致SiCf/SiC复合材料制孔时孔径精度难控制。针对此瓶颈,提出采用脉冲激光修整单层钎焊金刚石套料钻工作面磨粒,提高磨粒等高性以改善SiCf/SiC复合材料制孔精度的构想。研制单层钎焊金刚石套料钻的脉冲激光修整装置,能够显著提高套料钻工作面磨粒的等高性,修整后套料钻磨粒出露高度离散系数由修整前的0.11降低至0.04,降幅达64%。此外,修整后的套料钻在有效使用寿命范围内的孔径变化量维持在0.02 mm以内,相较未激光整形时孔径变化量降低75%,说明激光修整可提高单层钎焊金刚石套料钻工作面磨粒的等高性,实现SiCf/SiC复合材料精密制孔。

     

  • 图  1  有序排布的单层钎焊金刚石套料钻

    Figure  1.  Orderly-arranged single-layer brazed diamond core drill

    图  2  钎焊金刚石套料钻前端磨粒微观形貌

    Figure  2.  SEM of diamond grains on brazed core drill

    图  3  SiCf/SiC复合材料结构示意图

    Figure  3.  Structure of SiCf/SiC composites

    图  4  脉冲激光修整平台

    Figure  4.  Platform of laser dressing

    图  5  超声振动辅助制孔试验设置

    Figure  5.  Setups of ultrasonic vibration-assisted machining

    图  6  脉冲激光修整套料钻流程图

    Figure  6.  Procedure of pulsed laser dressing

    图  7  确定激光束总切深的操作流程

    Figure  7.  Procedure of determining total dressing depth

    图  9  钎焊金刚石套料钻激光修整过程及原理

    Figure  9.  Laser dressing process and schematic diagram of brazed diamond core drill

    图  8  2种不同材质标准棒修整效果对比

    Figure  8.  Comparison of dressing effects of two standard rods made of different materials

    图  10  脉冲激光修整前后钎焊金刚石套料钻轮廓线

    Figure  10.  Contour of brazed diamond core drill before and after laser dressing

    图  11  修整前后侧边磨粒实际高度图

    Figure  11.  Grain protrusion height before and after pulsed laser dressing

    图  12  激光整形后钎焊金刚石套料钻磨粒形貌

    Figure  12.  Diamond grits morphology of brazed diamond core drill after pulsed laser dressing

    图  13  激光修整前后单层钎焊金刚石套料钻制孔直径变化

    Figure  13.  Diameter of holes machined by single-layer brazed diamond core drill before and after pulsed laser dressing

    图  14  单层钎焊金刚石套料钻制孔过程

    Figure  14.  Drilling process of single-layer brazed diamond core drill

    图  15  脉冲激光修整前后钻削力信号

    Figure  15.  Signals of drilling force before and after pulse laser dressing

    表  1  SiCf/SiC复合材料机械属性

    Table  1.   Mechanical properties of SiCf/SiC composites

    材料 密度
    ρ / (g·cm−3)
    弹性模量
    E / GPa
    硬度
    H / GPa
    断裂韧性
    Kic / (MPa·m1/2)
    SiCf/SiC 2.0 289 23 26.4
    下载: 导出CSV

    表  2  脉冲激光修整钎焊金刚石套料钻参数

    Table  2.   Parameters of pulsed laser dressing of brazed diamond core drill

    参数 数值 参数 数值
    聚焦距离 s / mm 0 光斑直径 df / μm 40
    平均功率 pavg / W 50 脉宽 ω / ns 120
    脉冲频率 fp / kHz 50 往复扫描次数 Nz / 次 100
    扫描速度 vss / (mm·s−1) 400 旋转主轴转速 vsx / (r·min−1) 120
    下载: 导出CSV

    表  3  套料钻磨粒高度离散度分析

    Table  3.   Dispersion of grain protrusion height

    项目 修整前 修整后
    平均磨粒高度 $\bar H $ / mm 361.5 328.4
    方差 s2 1587.6 153.1
    标准差 s 39.8 12.4
    离散系数 Vs 0.11 0.04
    下载: 导出CSV
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出版历程
  • 收稿日期:  2023-11-20
  • 修回日期:  2024-01-13
  • 录用日期:  2024-02-26
  • 刊出日期:  2025-04-20

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