Effect of grinding wheel type and cooling method on grinding quality of SiCf/SiC ceramic matrix composites
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摘要: SiCf/SiC陶瓷基复合材料由于其耐高温和高比强度的特性，已成为航空发动机用先进材料之一。然而，作为一种难加工的硬脆材料，提高其加工质量和效率是当前研究的关键问题。采用电镀和烧结金刚石砂轮，在有无冷却液的条件下进行正交磨削试验，以磨削力、工件表面粗糙度和砂轮磨损程度为评价指标，探究不同砂轮种类及冷却方式对SiCf/SiC陶瓷基复合材料磨削加工质量的影响。结果表明：采用烧结金刚石砂轮磨削加工复合材料可得到更好的表面质量和较低的磨削力，同时采用冷却液辅助磨削会降低工件表面粗糙度；由于电镀金刚石砂轮在受到较大磨削力时其金刚石磨粒更易出现成片剥落现象，其使用结果与烧结金刚石砂轮的相反，且电镀金刚石砂轮的磨损形式除磨粒损耗外还包括磨粒的烧伤、脱落等。当粗加工SiCf/SiC陶瓷基复合材料时，应在干式磨削条件下使用电镀金刚石砂轮，并选取高转速、低进给速度及较小磨削深度的磨削参数；当精加工SiCf/SiC陶瓷基复合材料时，应采用烧结金刚石砂轮，并采用水冷辅助方式来显著提高工件加工表面质量。
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关键词:
- SiCf/SiC陶瓷基复合材料 /
- 磨削加工 /
- 表面粗糙度 /
- 砂轮种类 /
- 冷却方式
Abstract:Objectives SiCf/SiC fiber-reinforced ceramic matrix composites have been widely used in aerospace, nuclear energy, and high temperature structural parts due to their excellent high-temperature resistance, high specific strength, and oxidation resistance. However, due to the high hardness and brittleness of the material, its machinability is poor, and the traditional machining methods tend to cause serious tool wear, workpiece surface damage, and processing defects. Therefore, optimizing the grinding process to improve processing quality and efficiency has become one of the key issues in current research. Orthogonal grinding experiments of SiCf/SiC composites were carried out using electroplated diamond grinding wheels and sintered diamond grinding wheels, with or without coolant. Grinding force, surface roughness, and wear degree of grinding wheel were used as evaluation indexes to explore the effects of different grinding wheel types and cooling methods on the grinding quality of the material. Methods An orthogonal experimental design was used to systematically analyze the effects of different grinding wheel types (electroplated diamond grinding wheel, sintered diamond grinding wheel) and cooling methods (dry grinding, water cooling) on the grinding performance of SiCf/SiC composites. The experiment was conducted on a VMC850B CNC machine using a diamond grinding wheel with a diameter of 20 mm. Test parameters such as cutting speed, feed rate, and grinding depth were kept consistent to ensure comparability of results and scientific rigor of the experiment. During grinding, a KISTLER 9257B three-component dynamometer was used to measure tangential and radial grinding forces in real time to quantify the mechanical response under different grinding conditions. To evaluate the surface quality of the processed material, a ZYGO9000 white light interferometer was used to measure the surface roughness Sa of the workpiece. Three different regions of each sample were selected for measurement, and average values were taken to reduce the measurement error. Additionally, to analyze the wear mechanism of the grinding wheels, the wear morphology of the grinding wheel surface after grinding was observed using a VHX2000c ultra-depth-of-field three-dimensional microscope, and the failure modes of different grinding wheels under different grinding conditions were compared and analyzed. Results Grinding wheel type and cooling method have a significant effect on the grinding performance of SiCf/SiC composites. The grinding force of the sintered diamond grinding wheel is lower than that of the electroplated diamond grinding wheel, which is attributed to the higher abrasive retention and wear resistance of the sintered diamond grinding wheel. Compared with dry grinding, the grinding force is reduced under water-cooled conditions, indicating that the coolant can alleviate friction and heat accumulation during grinding to a certain extent, thereby reducing grinding force. At the same time, the sintered diamond grinding wheel can obtain lower surface roughness of the workpiece, the surface of the workpiece after processing is smoother, and the micro-defects such as cracks and tears are also significantly reduced. Furthermore, water-cooled assisted grinding can effectively reduce the surface roughness of workpiece and further improve the surface quality of workpiece, indicating that coolant positively influences surface integrity. The main wear form of the sintered diamond grinding wheel is the normal wear of abrasive particles, shweing strong abrasive retention and overall durability. In contrast, the electroplated diamond grinding wheel tends to flake off under the action of large grinding force, leading to rapid abrasive failure. Additionally, the electroplated diamond grinding wheel also has abrasive burn and falling off phenomenon, further reducing its service life. Therefore, from the perspective of processing performance and durability, the sintered diamond grinding wheel in grinding SiCf/SiC composite materials shows better comprehensive performance, especially under water-cooled conditions, where processing quality and stability are more advantageous. Discussion and optimization suggestions Based on experimental data analysis, to optimize the grinding process of SiCf/SiC composites, the grinding wheel type and cooling method should be reasonably selected according to different processing stages. In the rough machining stage, the electroplated diamond grinding wheel is prone to abrasive detachment under the action of higher grinding force, so it is suitable for dry grinding condition to reduce coolant impact on abrasive particles. At the same time, it is recommended to use high speed, low feed speed and shallow grinding depth to reduce wheel wear and improve processing efficiency. In contrast, during the precision machining stage, to achieve better surface quality, it is recommended to use a sintered diamond grinding wheel combined with water-cooled grinding method to reduce the surface roughness of the workpiece, minimize micro-defects, and thus improve the surface smoothness and machining stability of the workpiece. Conclusions The sintered diamond grinding wheel exhibits lower grinding force and better surface quality during grinding, especially under water-cooled conditions, where its advantages are more obvious. The electroplated diamond grinding wheel is suitable for rough machining, but there is a risk of abrasive peeling and burning, which affects its service life. Therefore, in practical applications, the grinding wheels and cooling methods should be reasonably selected based on different processing requirements to improve the processing quality and the efficiency of SiCf/SiC composites. Future research can further optimize the grinding parameters and explore the effects of different grinding environments (such as micro-lubrication) on machining performance to further enhance the controllability and applicability of grinding processes. -
Key words:
- SiCf/SiC ceramic matrix composite /
- grinding /
- surface roughness /
- grinding wheel type /
- cooling method
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图 4 干式磨削下2种砂轮的径向磨削力
Figure 4. Radial grinding forces of two types of grinding wheels under dry grinding
图 5 干式磨削下2种砂轮的磨削力比
Figure 5. Grinding force ratios of two types of grinding wheels under dry grinding
图 6 电镀砂轮不同冷却方式下的径向磨削力
Figure 6. Radial grinding forces of electroplated grinding wheel under different cooling methods
图 7 烧结砂轮不同冷却方式下的径向磨削力
Figure 7. Radial grinding forces of sintered grinding wheel under different cooling methods
图 8 复合材料表面粗糙度测量结果
Figure 8. Measurement results of surface roughness of composite materials
图 9 不同种类砂轮及不同冷却方式下的表面粗糙度Sa综合对比
Figure 9. Comprehensive comparison of surface roughness Sa under different types of grinding wheels and different cooling methods
图 10 干式磨削下主轴转速对表面粗糙度的影响
Figure 10. Influence of spindle speed on surface roughness under dry grinding
图 11 干式磨削下进给速度对表面粗糙度的影响
Figure 11. Influence of feed rate on surface roughness in dry grinding
图 12 干式磨削下磨削深度对表面粗糙度的影响
Figure 12. Influence of grinding depth on surface roughness in dry grinding
图 13 水冷条件下主轴转速对表面粗糙度的影响
Figure 13. Influence of spindle speed on surface roughness under water cooling condition
图 14 水冷条件下进给速度对表面粗糙度的影响
Figure 14. Influence of feed rate on surface roughness under water cooling condition
图 15 水冷条件下磨削深度对表面粗糙度的影响
Figure 15. Influence of grinding depth on surface roughness under water cooling condition
图 16 电镀金刚石砂轮中磨粒的平面磨损及面积
Figure 16. Planar wear and area of abrasive particles in electroplated diamond grinding wheels
图 17 电镀金刚石砂轮磨削加工后的表面形貌及磨损现象
Figure 17. Surface morphology and wear phenomenon of electroplated diamond grinding wheel after grinding
图 18 烧结金刚石砂轮中磨粒的平面磨损及面积
Figure 18. Plane wear and area of abrasive particles in sintered diamond grinding wheels
图 19 烧结金刚石砂轮磨削加工后的表面形貌
Figure 19. Surface morphology of sintered diamond grinding wheel after grinding
材料属性 数值 密度 ρ / (g·cm−3) 2.26 ± 0.03 气孔率 φ / % 10 ± 0.8 纤维直径 D / µm ≈12 拉伸强度 σ1 / MPa 271.4 ± 29.0 弯曲强度 σ2 / MPa 443.8 ± 26.6 层间剪切强度 σ3 / MPa 63.2 ± 9.9 压缩强度 σ4 / MPa 454.0 ± 18.2 断裂韧性 KIC / (MPa·m1/2) 24.1 ± 2.3 
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表 2 试验参数表
Table 2. Test parameter table
组号 主轴转速
n / (r·min−1)进给速度
vf / (mm·min−1)磨削深度
ap / mm1 3 200 35 0.2 2 3 200 40 0.4 3 3 200 45 0.6 4 3 600 35 0.4 5 3 600 40 0.6 6 3 600 45 0.2 7 4 000 35 0.6 8 4 000 40 0.2 9 4 000 45 0.4
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表 3 不同砂轮不同冷却方式下的Sa值
Table 3. Sa values under different grinding wheels and cooling methods
组号 表面粗糙度 Sa / μm 电镀−干式 电镀−水冷 烧结−干式 烧结−水冷 1 3.923 7.375 2.405 1.545 2 2.652 6.046 2.235 1.165 3 1.753 5.652 1.413 1.045 4 2.635 3.672 2.567 1.429 5 3.036 6.533 2.902 2.026 6 5.196 7.855 3.119 2.919 7 2.312 5.299 1.761 3.556 8 2.624 5.441 2.347 3.982 9 2.843 8.862 2.647 6.485
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