Experiment of double grits scribing 2D SiCf/SiC composite
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摘要: 为揭示2D SiCf/SiC复合材料的磨削去除机理和磨粒间的耦合作用，在纤维编织表面（woven surface, WS）和叠加表面（stacking surface, SS）上，进行WS0、WS45和SS0、SS90方向的双磨粒划擦实验，观察划痕表面形貌，并测量划擦力。结果表明：横向纤维主要为剪切、拉伸和弯曲断裂；法向纤维以剪切去除为主，边缘伴随有少量的弯曲去除；纵向纤维的去除以拉伸（切入点）和弯曲（切出点）断裂为主，伴随有大量的纤维剥离；基体的去除形式有裂纹扩展、延性划痕、粉末化去除和脆性剥离。划擦力大小顺序为FSS0 > FWS45 > FSS90 > FWS0，在SS0时大量的基体被粉末化去除而消耗较多的能量，WS0时主要是横向纤维和纵向纤维的去除。与单颗磨粒实验对比，去除相同体积的材料，双磨粒的法向划擦力合力小于单颗磨粒划擦的法向划擦力合力，第1颗磨粒划擦后在表面形成的损伤导致第2颗磨粒去除相同体积材料时需要的能量降低，磨粒之间表现出较强的耦合关系，使2D SiCf/SiC复合材料磨削力降低的同时获得更好的表面质量。
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关键词:
- 双磨粒划擦 /
- SiCf/SiC复合材料 /
- 纤维取向 /
- 划擦力 /
- 表面形貌
Abstract:Objectives To improve the grinding quality and efficiency, reveal the material removal mechanism of SiCf/SiC composites, and determine the coupling effect among abrasives during grinding. Methods Firstly, uniaxial tensile, shearing, and bending experiments of SiC fiber bundles are conducted to observe damage modes. Secondly, double-abrasive scratching experiments are carried out on the woven surface (WS) and stacking surface (SS) of 2D SiCf/SiC composites along the 0°, 45°, and 90° fiber directions, respectively. The scratch surface topographies are observed and the scratch force is measured to reveal the material removal mechanism and abrasive coupling effect. Results The tensile-fractured SiC fiber shows a 45° bevel fracture surface at the tip. The shear-fractured SiC fiber tip surface is perpendicular to the axis of the SiC fiber. The bending-fractured SiC fiber shows a hybrid of bevel and perpendicular surfaces, indicating both tensile and shear fracture characteristics. In the longitudinal fiber cut-in direction on WS0, the matrix shows a large area of ductile removal scratching. The fiber shows tensile fracture, and the broken fiber is peeled off from the matrix, with some fiber tips showing tensile fractures. Bending fracture also occurs in the cutting direction of WS0 longitudinal fibers, and a large number of fiber peel-off marks are observed on the surface. At the same time, ductile removal marks of the matrix and some large-sized fibers appears on the surface. The transverse fibers on WS0 show the characteristics of tensile fracture, bending fracture, and shear fracture simultaneously. There are tensile fractures, bending fractures, and shear fractures on the surface of WS45 fiber. The ductile removal and fiber peeling also appear on the fiber. A shear fracture occurs on the SS0 fiber and bending fracture occurs at the boundary of the woven structure. The removal modes of SS0 longitudinal fibers are mainly tensile and shear fractures, accompanied by secondary scratches formed by fiber exposure. SS90 fibers show shear and bending fractures at the boundary. The transverse fibers show tensile, shear, and bending fractures while the matrix shows strong brittle removal. The scratching force varies significantly with fiber orientations. The order of scratching force is FSS0 > FWS45 > FSS90 > FWS0. Under the same scratching depth, the normal scratching force of the double abrasives is much smaller than that of a single abrasive. Conclusions (1) In scratching of 2D SiCf/SiC, the transverse fibers undergo shear, tensile, and bending fractures. The fiber is removed by shearing, with a small amount of bending removal occuring at the woven boundary. The longitudinal fibers mainly exhibit tensile (cut-in) and bending (cut-out) fractures, accompanied by a large number of fiber peeling. The removal forms of the matrix include crack propagation, ductile scratching, powder removal, and brittle peeling. (2) 2D SiCf/SiC shows strong anisotropy. The order of scratching force obtained under different surfaces and scratching directions is FSS0 > FWS45 > FSS90 > FWS0. The material removal energy consumed in the WS0 direction is the lowest while SS0 consumes the most. At this time, a large number of matrices are powdery. The normal scratching force of the double abrasives is much smaller than that of the single abrasive. For the same volume of material removed, the first abrasive causes more surface damage after scratching, reducing the scratching force of the second abrasive. This indicates a strong coupling relationship between the abrasives, which can effectively reduce the normal scratching force when processing 2D SiCf/SiC composites. -
Key words:
- double grit scribing /
- SiCf/SiC composite /
- fiber orientations /
- scribing force /
- surface morphology
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图 1 双磨粒划擦2D SiCf/SiC实验设置
Figure 1. Double grits scribing 2D SiCf/SiC experimental setup
图 4 划擦前后磨粒表面形貌对比
Figure 4. Surface morphology comparison of grits before and after scribing
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