Chemical-mechanically polishing large areafree-standing CVD diamond films

ZHANG Pingwei; TONG Tingting; CAI Yunhong

doi:Code:10.13394/j.cnki.jgszz.2018.6.0013

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Chemical-mechanically polishing large areafree-standing CVD diamond films

doi: Code:10.13394/j.cnki.jgszz.2018.6.0013

1. Hebei Plasma Diamond Technology Co., Ltd., Shijiazhuang 050000, China;
2. Hebei Institute of Laser, Shijiazhuang 050000, China

详细信息

中图分类号: TG175
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- 被引次数: 0
出版历程
- 修回日期: 2018-11-27
- 网络出版日期: 2022-07-10

Chemical-mechanically polishing large areafree-standing CVD diamond films

1. Hebei Plasma Diamond Technology Co., Ltd., Shijiazhuang 050000, China;
2. Hebei Institute of Laser, Shijiazhuang 050000, China

摘要

摘要: Chemical mechanical polishing is used to polish large area free-standing CVD diamond films with diameters of 66 mm. The influence of polishing plates (iron plate, asphalt plate and soft cushion) and oxidizing agents (K₂S₂O₈ and K₂FeO₄) on polishing results are investigated. Profilometer (tip radius 5 μm), optical microscope and Raman spectroscopy are used to evaluate the polishing effects of the CVD diamond films. Results show that the material removal rate of iron plate is the highest, while the surface polished by soft cushion is the most uniform with roughness of 2 nm. It is also found that the most effective oxidizing agent is K₂FeO₄. In conclusion, the optimum polishing conditions are soft cushion and K₂FeO₄.
- polishing plate /
- oxidizing agent /
- material removal rate /
- surface roughness
Abstract: Chemical mechanical polishing is used to polish large area free-standing CVD diamond films with diameters of 66 mm. The influence of polishing plates (iron plate, asphalt plate and soft cushion) and oxidizing agents (K₂S₂O₈ and K₂FeO₄) on polishing results are investigated. Profilometer (tip radius 5 μm), optical microscope and Raman spectroscopy are used to evaluate the polishing effects of the CVD diamond films. Results show that the material removal rate of iron plate is the highest, while the surface polished by soft cushion is the most uniform with roughness of 2 nm. It is also found that the most effective oxidizing agent is K₂FeO₄. In conclusion, the optimum polishing conditions are soft cushion and K₂FeO₄.
- polishing plate /
- oxidizing agent /
- material removal rate /
- surface roughness