Research on drill-grinding silicon nitride ceramic with thin-wall brazed diamond drill

Silicon nitride ceramic was drill-ground with single-layer brazed diamond thin-wall drill.Firstly,the removal mechanism of silicon nitride ceramic was studied,which mainly included brittle removal and ductile regime removal,and brittle removal was the main removal mechanism.Secondly,the influence of wall thickness,spindle speed and drilling pressure on the machining efficiency was studied.The results showed that three parameters all had optimal values,namely 1.5 mm,710 r/min and 613 N respectively.Wall thickness should not exceed 2 mm,the spindle speed no more than 900 r/min,and the drilling pressure should be within the range of 500 to 705 N.If the drilling pressure was less than 330 N,the cutting tool would slip.