Influence of slurry on lapping SiC workpiece by using fixed abrasives

For efficient and stable machining the SiC workpiece, slurries containing SiC particles are used to assist precision lapping SiC with hydrophilic fixed abrasive pad. Experiments are conducted to compare the difference of slurry-assisted lapping and traditional lapping, as well as the influence of the size and concentration of SiC particles in the slurry on the material removal rate and surface of SiC workpiece after precision lapping. The swelling rate and wear rate of pad matrix are tested and calculated, thus exploring the mechanism of SiC slurry. The results show that when adding SiC sized 3-5 μm with mass fraction 3% in to the slurry, the average material removal rate of precision lapping is 1.424 6 μm/min with surface roughness of workpiece 84.6 nm, while the rate and roughness of traditional lapping are 0.040 0 μm/min and 61.4 nm, respectively. In conclusion, adding SiC particles could enhance the self-dressing of the pad. As the size and concentration of SiC particles increase, the self-dressing effect is enhanced, resulting in higher material removal rate but slightly poorer surface quality.