Sawed surface analysis of natural diamond

SHI Guangfeng; FU Wang; WANG Shukun; HAN Dongdong; ZHANG Hua; LIU Siyu

doi:10.13394/j.cnki.jgszz.2019.2.0003

Volume 39 Issue 2

Apr. 2019

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Article Navigation > Diamond & Abrasives Engineering > 2019 > 39(2): 13-16

SHI Guangfeng, FU Wang, WANG Shukun, HAN Dongdong, ZHANG Hua, LIU Siyu. Sawed surface analysis of natural diamond[J]. Diamond & Abrasives Engineering, 2019, 39(2): 13-16. doi: 10.13394/j.cnki.jgszz.2019.2.0003

Citation:

SHI Guangfeng, FU Wang, WANG Shukun, HAN Dongdong, ZHANG Hua, LIU Siyu. Sawed surface analysis of natural diamond[J]. Diamond & Abrasives Engineering, 2019, 39(2): 13-16. doi: 10.13394/j.cnki.jgszz.2019.2.0003

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Sawed surface analysis of natural diamond

doi: 10.13394/j.cnki.jgszz.2019.2.0003

College of Mechanical and Electrical Engineering, Changchun University of Science and Technology, Changchun 130022, China

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Rev Recd Date: 2019-02-10

Abstract

Abstract

Sawing diamond is a cutting method with high processing precision. Diamond cutting machine is used to cut natural diamond, and then the sawing diamond cutting surface is detected and analyzed by optical microscope, roughness measuring instrument and X-ray diffractometer. The surface morphology, roughness and crystal image of natural diamond (100) crystal surface are obtained. The results show that tool trace is the main factor affecting the quality of natural diamond sawing surface processing. It is also found that isomerization of carbon occurs on the surface after cutting and generates a non-graphitizing carbon allotrope, whose content on the surface of the tool trace is 8.3% but 2.0% on smooth surface. Good natural diamond cutting surface can be obtained by normal sawing method.
- natural diamond,
- cutting,
- roughness,
- crystal phase