Application of PA1212 in resin bond grinding wheel for PCB tools

Polyimide resin grinding wheel was improved by adding micron sized polyamide 1212 (PA1212). The durability, the lifetime and the surface quality of printed circuit board (PCB) tools before and after improving the wheel were studied by grinding tests. Results show that after adding PA1212, the durability of the grinding wheel for PCB tools is improved by 59.5%, lifetime increased by 71.2%. It is also found that the probability of collapse at tool edge during grinding is greatly reduced and that the surface texture of the tool is more uniform.