Preparation and properties of nickel-boron-diamond ultrathin dicing blades

Diverse concentrations of trimethylamine borane(TMAB)were added into the nickel sulfamate electrolyte.The Ni-B-diamond dicing blades with different boron content were prepared by composite electrodeposition under the state of spinning the cathode.The influence of different concentrations of TMAB on the crystal structure, the hardness, and the wear resistance of the dicing blades were explored.The results show that the diamond on the dicing blades prepared under the spinning state of the cathode is distributed uniformly.With the increase of TMAB mass concentration, the grain size is decreased, the hardness and the wear resistance is improved.When the TMAB mass concentration is 3.0 g/L, the minimum grain size of the substrate metal is 6.84 nm, the maximum hardness is 2 453.6 HV, the minimum wear is 1.7×10^-2 mm³,and the minimum wear width is 665.4 μm.The Ni-B-diamond cutting disc with a thickness of 28.3 μm is used to cut the N-type single crystal silicon wafer with a crystal plane of(111).The groove width of the silicon wafer is 35.3 μm, the ratio of groove width to knife thickness is 1.25, and the maximum chipping size is 3.1 μm.