Study on preparation of diamond/copper compositesby high temperature and high pressure method

ZHAO Long; SONG Pingxin; ZHANG Yingjiu; YANG Tao; MA Shanshan; WANG Caili

doi:10.13394/j.cnkij.gszz.2018.2.0004

Volume 38 Issue 2

Apr. 2018

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ZHAO Long, SONG Pingxin, ZHANG Yingjiu, YANG Tao, MA Shanshan, WANG Caili. Study on preparation of diamond/copper compositesby high temperature and high pressure method[J]. Diamond & Abrasives Engineering, 2018, 38(2): 15-19. doi: 10.13394/j.cnkij.gszz.2018.2.0004

Citation:

ZHAO Long, SONG Pingxin, ZHANG Yingjiu, YANG Tao, MA Shanshan, WANG Caili. Study on preparation of diamond/copper compositesby high temperature and high pressure method[J]. Diamond & Abrasives Engineering, 2018, 38(2): 15-19. doi: 10.13394/j.cnkij.gszz.2018.2.0004

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Study on preparation of diamond/copper compositesby high temperature and high pressure method

doi: 10.13394/j.cnkij.gszz.2018.2.0004

Key Material Physics Laboratory of the Ministry of Education, Institute of Physical Scienceand Engineering of Zhengzhou University, Zhengzhou 450052, China

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Rev Recd Date: 2018-01-12

Available Online: 2022-07-07

Abstract

Abstract

Diamond-copper composites were prepared by high temperature and high pressure method (HPHT). The effects of diamond volume fraction, sintering pressure, holding time, sintering temperature, surface metallization of diamond on thermal conductivity and thermal expansion coefficient of diamond-copper composites were studied. The experimental results show that when diamond volume fraction is 70%, sintering pressure is 2 GPa, sintering time is 300 s, and sintering temperature is 1200℃, the thermal conductivity of diamond-copper composite material reaches 426 W/(m·K).
- HPHT method,
- diamond/copper composites,
- thermal conductivity,
- coefficient of thermal expansion