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Volume 45 Issue 4
Aug.  2025
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Article Navigation >  Diamond & Abrasives Engineering  > 2025  >  45(4): 486-495
GUO Weicheng, HAN Shaojie, HE Qichao, GUO Miaoxian. Ultra-low temperature grinding process and surface integrity of SiCp/Al material[J]. Diamond & Abrasives Engineering, 2025, 45(4): 486-495. doi: 10.13394/j.cnki.jgszz.2024.0129
Citation: GUO Weicheng, HAN Shaojie, HE Qichao, GUO Miaoxian. Ultra-low temperature grinding process and surface integrity of SiCp/Al material[J]. Diamond & Abrasives Engineering, 2025, 45(4): 486-495. doi: 10.13394/j.cnki.jgszz.2024.0129
shu

Ultra-low temperature grinding process and surface integrity of SiCp/Al material

doi: 10.13394/j.cnki.jgszz.2024.0129
  • 1.

    College of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China

  • 2.

    Shanghai Aerospace Equipments Manufacturer Co., Ltd., Shanghai 200245, China

More Information
  • Received Date: 2024-08-22
  • Rev Recd Date: 2024-10-09
    Abstract
  •   Objectives  As a new-generation high-performance structural material, silicon carbide particle-reinforced aluminum matrix composites (SiCp/Al) exhibit outstanding specific strength, wear resistance, and thermal stability, making them highly valuable in aerospace precision components, electronic packaging substrates, and other advanced manufacturing fields. However, common machining-induced damage issues such as matrix smearing and particle fragmentation severely compromise surface integrity and service performance. This study focuses on 20% SiCp/Al composites, systematically investigating the effects of process parameters on grinding force evolution, surface damage mechanisms, and surface integrity by comparing liquid nitrogen ultra-low temperature and room temperature air-cooling grinding conditions. The aim is to reveal the regulatory mechanisms of ultra-low temperature environments on composite machining performance and provide theoretical guidance for precision process optimization.  Methods  Grinding experiments are conducted on 20% SiCp/Al composites using diamond grinding wheels under single-factor conditions. The ultra-low temperature grinding experiments are performed on a vertical machining center with internal liquid nitrogen jet cooling, while conventional room temperature air-cooling serves as the control group. Process parameters includes wheel speed 2.04 to 2.98 m/s, feed rate 50 to 200 mm/min, grinding depth 5 to 20 μm, and grinding width 6 mm. A dynamometer monitored normal and tangential grinding forces in real time. Surface roughness is measured via white light interferometry, residual stress measured via X-ray diffraction analysis, and microhardness measured via a microhardness tester. Surface and subsurface damage is characterized using scanning electron microscopy.  Results  (1) Under both cooling conditions, grinding forces decreases with increased wheel speed and increases linearly with feed rate and grinding depth. The ultra-low temperature environment significantly enhances material yield strength and interfacial bonding strength, resulting in average grinding forces 1.7 to 2.7 times higher than those under room temperature air-cooling conditions. While room temperature grinding forces shows minor variations with parameter changes, wheel speed and feed rate exerts substantial impacts in ultra-low temperature grinding. (2) Grinding-induced damage in SiCp/Al primarily manifests as matrix smearing/tearing and SiC particle fracture/pullout. Despite higher grinding forces under ultra-low temperature conditions, surface damage is consistently less severe than under room temperature cooling. In ultra-low temperature grinding, reduced thermal effects and increased material strength/hardness promotes localized stress concentration, leading to minor matrix smearing and particle fracture. In contrast, room temperature grinding induces extensive matrix tearing, particle pullout, and associated cracks/pits. (3) Ultra-low temperature grinding effectively suppresses matrix smearing, pits, and crack propagation, achieving surface roughness values 16% to 42% lower than those under room temperature air-cooling conditions. Higher grinding forces under ultra-low temperature conditions enhances plastic deformation strengthening, while liquid nitrogen cooling minimizes thermal softening effects. Consequently, ultra-low temperature grinding generates larger residual compressive stress magnitudes and higher surface microhardness compared to room temperature grinding.  Conclusions  The liquid nitrogen ultra-low temperature environment significantly improves the mechanical properties of the SiCp/Al matrix and interfaces through cryogenic strengthening. Although grinding forces increase, this approach effectively suppresses machining damage, substantially reduces surface roughness, and generates enhanced residual compressive stress fields and uniform hardened layers. The influence of process parameters on grinding forces and surface integrity follows similar trends under both cooling conditions. Optimal parameter combinations with higher wheel speeds and smaller depths of cut enable efficient, low-damage machining. The transition in damage mechanisms and improvements in surface integrity validate that ultra-low temperature environments optimize material removal processes through thermo-mechanical coupling suppression and mechanical property enhancement, offering a novel pathway for precision machining of particle-reinforced composites.

     

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