Application of diamond based materials and surface microchannel fabricationtechnology in efficient heat dissipation

DENG Shibo; XIA Yongqi; WU Mingtao; YUE Xiaobin; LEI Dajiang

doi:10.13394/j.cnki.jgszz.2023.0132

Volume 44 Issue 3

Jun. 2024

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Article Navigation > Diamond & Abrasives Engineering > 2024 > 44(3): 286-296

DENG Shibo, XIA Yongqi, WU Mingtao, YUE Xiaobin, LEI Dajiang. Application of diamond based materials and surface microchannel fabricationtechnology in efficient heat dissipation[J]. Diamond & Abrasives Engineering, 2024, 44(3): 286-296. doi: 10.13394/j.cnki.jgszz.2023.0132

Citation:

DENG Shibo, XIA Yongqi, WU Mingtao, YUE Xiaobin, LEI Dajiang. Application of diamond based materials and surface microchannel fabricationtechnology in efficient heat dissipation[J]. Diamond & Abrasives Engineering, 2024, 44(3): 286-296. doi: 10.13394/j.cnki.jgszz.2023.0132

Citation:

DENG Shibo, XIA Yongqi, WU Mingtao, YUE Xiaobin, LEI Dajiang. Application of diamond based materials and surface microchannel fabricationtechnology in efficient heat dissipation[J]. Diamond & Abrasives Engineering, 2024, 44(3): 286-296. doi: 10.13394/j.cnki.jgszz.2023.0132

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Application of diamond based materials and surface microchannel fabricationtechnology in efficient heat dissipation

doi: 10.13394/j.cnki.jgszz.2023.0132

1.
Sichuan Precision and Ultra-Precision Machining Engineering Technology Center, Chengdu 610200, China
2.
College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
3.
Institute of Materials, China Academy of Engineering Physics, Mianyang 621908, Sichuan, China

More Information

Received Date: 2023-06-21
Accepted Date: 2023-11-03
Rev Recd Date: 2023-10-08

Available Online: 2023-11-06

Abstract

Abstract

With the rise of third-generation semiconductors, electronic devices are evolving towards high-power, miniaturization, and integration. Traditional heat dissipation technologies are no longer sufficient to meet the heat dissipation requirements of high heat flux in third-generation semiconductor devices. Temperature accumulation has become a major cause of device failure. Diamond-based materials have excellent thermal properties. Efficient heat dissipation technology based on these materials has become a key direction to solve the high heat flux dissipation problem. This article summarizes the development of diamond-based materials and the main methods for preparing surface microchannels. It reviews the application and development trends of diamond-based materials in the field of efficient heat dissipation. The development and application of diamond-based materials for efficient heat dissipation technology can provide technical support for addressing the problem of high heat flux dissipation.
- diamond,
- microchannel,
- fabrication,
- efficient heat dissipation

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References(50)

References

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