Design and analysis of spiral plating solution flow and rotating magnetic field device for electroplated diamond wire saw

HUANG Wei; HE Yanming; XU Jinbao; SONG Zhenya; HUANG Xiang; SUN Yumeng; YU Ximeng

doi:10.13394/j.cnki.jgszz.2023.0266

Volume 45 Issue 2

Apr. 2025

Turn off MathJax

Article Contents

Article Navigation > Diamond & Abrasives Engineering > 2025 > 45(2): 224-235

HUANG Wei, HE Yanming, XU Jinbao, SONG Zhenya, HUANG Xiang, SUN Yumeng, YU Ximeng. Design and analysis of spiral plating solution flow and rotating magnetic field device for electroplated diamond wire saw[J]. Diamond & Abrasives Engineering, 2025, 45(2): 224-235. doi: 10.13394/j.cnki.jgszz.2023.0266

Citation:

HUANG Wei, HE Yanming, XU Jinbao, SONG Zhenya, HUANG Xiang, SUN Yumeng, YU Ximeng. Design and analysis of spiral plating solution flow and rotating magnetic field device for electroplated diamond wire saw[J]. Diamond & Abrasives Engineering, 2025, 45(2): 224-235. doi: 10.13394/j.cnki.jgszz.2023.0266

Citation:

HUANG Wei, HE Yanming, XU Jinbao, SONG Zhenya, HUANG Xiang, SUN Yumeng, YU Ximeng. Design and analysis of spiral plating solution flow and rotating magnetic field device for electroplated diamond wire saw[J]. Diamond & Abrasives Engineering, 2025, 45(2): 224-235. doi: 10.13394/j.cnki.jgszz.2023.0266

PDF( 2674 KB)

Design and analysis of spiral plating solution flow and rotating magnetic field device for electroplated diamond wire saw

doi: 10.13394/j.cnki.jgszz.2023.0266

HUANG Wei^{1, 3
,},
HE Yanming²,
XU Jinbao¹,
SONG Zhenya⁴,
HUANG Xiang⁵,
SUN Yumeng^{5
,
,},
YU Ximeng^{5
,
,}

1.
Zhejiang Lingzhou Intelligent Equipment Co., Ltd., Shaoxing 312000, Zhejiang, China
2.
College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
3.
Shaoxing Science and Technology Information Research Institute, Shaoxing 312000, Zhejiang, China
4.
Shaoxing Tianlong Tin Materials Co., Ltd., Shaoxing 312001, Zhejiang, China
5.
Shaoxing Testing Institute of Quality and Technical Supervision, Shaoxing 312366, Zhejiang, China

More Information

Received Date: 2023-12-05
Accepted Date: 2024-06-17
Rev Recd Date: 2024-06-02

Abstract

Abstract

Objectives In response to the defects of diamond abrasive particle aggregation and large density fluctuations on the surface of traditional electroplated diamond wire saws, an innovative design of a combination device of spiral bath flow and rotating magnetic field is proposed to break through the technical bottlenecks of existing electroplating processes in terms of coating uniformity, orderly arrangement of diamonds and tool life. The research focuses on solving three core problems: (1) the structural design of the spiral bath flow electroplating device and the optimization of flow rate and spiral speed of the spiral bath flow; (2) the structural design of the rotating magnetic field device and the optimization of rotation speed and magnetic field strength; (3) the optimal process parameters for electroplating diamond wire saws in the new composite field electroplating device, and the production of wire saws for silicon wafer cutting experiments. Methods The electroplating mixture spirals in the same direction around the baseline, which can improve the consistency of diamond particle concentration around the baseline circumference and enhance the uniformity of the mixed solution stirring. Based on this, the spiral bath flow electroplating device is designed. Then the rotating magnetic field device is designed by experiment, and a suitable alternating magnetic field is applied to the plating solution, which is beneficial to improve the deposition rate and the consolidation strength of the diamond particles with the baseline. The spiral bath flow electroplating device and the rotating magnetic field device together form the electroplating combination device. Through the data accumulation of continuous experiments and production practice, the basic parameters such as permanent magnet material, magnet size, inner wall size of the glass tube, baseline travel speed, and bottom diameter of the spiral blade in the combined device are determined. The optimal technological parameters of the electroplated diamond wire saw for the combined device are obtained by the single-factor experiment method, and the wire saw is made. The surface morphologies of electroplated diamond wire saws prepared under different processes are observed by scanning electron microscope, and the monocrystalline silicon is sliced by an ultra-high speed multi-wire cutting machine. The surface roughness of the silicon wafer in the feed direction is measured by a surface roughness tester. Results The mixed liquid of the spiral bath flow electroplating device enters the glass tube from the spiral blades of the spiral guide inner core, rotates spirally upward around the baseline in the glass tube under the action of the spiral blades, and flows out from the outlet of the mixed solution in the glass tube. Four symmetrical grooves are set on the inner wall of the glass tube for placing nickel anodes to avoid hindering the flow of the spiral liquid. The baseline enters from the hollow center of the spiral guide core and passes upward through the electroplating device, and the baseline is not in direct contact with the spiral guide inner core. According to the inner diameter value of the glass tube d = 56 mm, the minimum flow rate of the mixed liquid calculated is Q = 4.43 L/min. The inner core material of the spiral guide is TA2 titanium alloy, the bottom diameter of the spiral blade is 12 mm, the helix angle is 60°, the thickness is 2 mm, and the outer diameter and the height are consistent with d. The rotating magnetic field device is composed of NdFeB alloy cylinders and a fixed holder, etc., which rotates precisely around the center line of the spiral bath flow electroplating device at the appropriate rotation speed. The basic parameters of the combined device are: the magnet size is φ20 mm × 30 mm, the inner wall diameter × length of the glass tube is φ56 mm × 850 mm, the baseline travel speed is less than or equal to 20 m/min, the bottom diameter of the spiral blade is 5 mm, the blade thickness is 2 mm, and the concentration of diamond abrasive is 1.55 g/L. The optimal process parameters for electroplating diamond wire saws in the combination device, determined by single-factor experiment are: the spiral blade number is 5, the spiral angle is 60°, the mixed liquid flow rate is 4.80 L/min, the fixed holder number is 12, the staggered arrangement angle of the permanent magnets is 60°, the magnetic field rotation speed is 60 r/min, and the magnetic field strength of the N38M permanent magnet is 0.549 T. The electroplating line produced under the optimal process parameters shows that the diamond particles are evenly distributed on the baseline surface without any stacking or agglomeration phenomenon, and the particle distribution density is basically uniform. The number of diamond particles is 15 to 25 particles/mm, and the fluctuation range of diamond particle numbers is controlled within 11 particles/mm. Using this wire saw to slice a single crystal silicon rod with φ50.6 mm, the surface roughness R_a value of the silicon wafer in the feed direction is 0.583 μm, which is 35.9% and 28.2% lower than the literature values, respectively. Conclusions The combined device of spiral bath flow and rotating magnetic field is designed to make the diamond abrasive particles in the mixed liquid evenly distributed in the bath flow mode, and orderly arranged according to the magnetic field line and rotated around the baseline. This can basically eliminate the diamond agglomeration defect on the surface of the wire saw and improve the uniformity of the distribution density of diamond particles. The average surface roughness of the silicon wafer in the feed direction is lower, so the workload of the subsequent grinding process can be reduced.
- electroplated diamond wire saw,
- abrasive aggregation,
- particle distribution density,
- spiral plating solution flow,
- rotating magnetic field

FullText(HTML)

References(26)

References

[1]	代晓南, 白玲, 邢勇, 等. 基线磁化对金刚石线锯制备工艺的影响 [J]. 超硬材料工程,2020,32(3):13-16. doi: 10.3969/j.issn.1673-1433.2020.03.004 DAI Xiaonan, BAI Ling, XING Yong, et al. Effect of baseline magnetization on the preparation of diamond wire saw [J]. Superhard Material Engineering,2020,32(3):13-16. doi: 10.3969/j.issn.1673-1433.2020.03.004
[2]	黄炜, 徐金宝, 吕忠光, 等. 单晶硅棒等高硬脆性材料锯切线及其制备技术的现状与发展趋势 [J]. 世界有色金属,2023(6):137-141. doi: 10.3969/j.issn.1002-5065.2023.18.045 HUANG Wei, XU Jinbao, LV Zhongguang, et al. Current situation and development trend of sawing wire and its preparation technology for high hard and brittle materials such as single crystal silicon rod [J]. World Nonferrous Metals,2023(6):137-141. doi: 10.3969/j.issn.1002-5065.2023.18.045
[3]	张凤林, 袁慧, 周玉梅, 等. 硅片精密切割多线锯研究进展 [J]. 金刚石与磨料磨具工程,2006(6):14-18. doi: 10.3969/j.issn.1006-852X.2006.06.005 ZHANG Fenglin, YUAN Hui, ZHOU Yumei, et al. Progress of multi-wire for precision slicing of silicon wafer [J]. Diamond & Abrasives Engineering,2006(6):14-18. doi: 10.3969/j.issn.1006-852X.2006.06.005
[4]	张晨政, 葛培琪, 陈自彬, 等. 电镀金刚石线锯使用性能的试验研究 [J]. 金刚石与磨料磨具工程,2021,41(6):74-79. doi: 10.13394/j.cnki.jgszz.2021.6.0013 ZHANG Chenzheng, GE Peiqi, CHEN Zibin, et al. Experimental analysis on application performance of electroplated diamond wire saw [J]. Diamond & Abrasives Engineering,2021,41(6):74-79. doi: 10.13394/j.cnki.jgszz.2021.6.0013
[5]	WALTERS J, SUNDER K, ANSPACH O, et al. Challenges associated with diamond wire sawing when generating reduced thickness mono-crystalline silicon wafers: 2016 IEEE 43rd photovoltaic specialists conference ( PVSC) [C]. Portland, USA: IEEE, 2016.
[6]	German Mechanical Engineering Industry Association. International technology roadmap for photovoltaic [R] . Frankfurt: VDMA, 2019.
[7]	全国半导体设备和材料标准化技术委员会. 光伏用树脂金刚石切割线: GB / T 34983—2017[S]. 北京: 中国标准出版社, 2017. National Technical Committee for Standardization of Semiconductor Equipment and Materials. Resin bond diamond wire for photovoltaic applications: GB / T 34983—2017 [S]. Beijing: Standards Press of China, 2017.
[8]	远瞻财经. 产能释放业绩反转, 岱勒新材: 细线化 + 薄片化支撑金刚线火热需求[DB/OL]. (2023-10-28)[2023-11-25]. Https://baijiahao.baidu.com/s?id=1780988180006727831&wfr=spider&for=pc. Yuan Zhan Finance and Economics. Capacity release and performance reversal, Dialine New Material: Production capacity release drives performance reversal, with thin and thin lines supporting the hot demand for diamond wire production. [DB/OL]. (2023-10-28) [2023-11-25]. Https://baijiahao.baidu.com/s?id=1780988180006727831&wfr=spider&for=pc.
[9]	徐金宝, 吕忠光. 一种丝线视觉检测装置: CN202123054296. X [P]. 2022-05-31. XU Jinbao, LV Zhongguang. A test equipment for wire based on visual method : CN202123054296 . X [P]. 2022-05-31.
[10]	徐金宝, 吕忠光. 一种粉末自动加料装置: CN202123054283.2 [P]. 2022-05-31. XU Jinbao, LV Zhongguang. An automatic feeding equipment for powder material: CN202123054283.2 [P]. 2022-05-31.
[11]	赵炎五, 郭伟信, 彭永强, 等. 一种金刚线钻石粉颗粒分布均匀性评估方法: CN202211204996.9 [P]. 2022-12-30. ZHAO Yanwu, GUO Weixin, PENG Yongqiang, et al. An evluation method of particle distribution uniformity for diamond wire: CN202211204996.9 [P]. 2022-12-30.
[12]	钱康乐, 徐金宝, 吕忠光, 等. 一种金属细丝表面增材金刚石磨粒的装置: CN2022322617470X [P]. 2023-09-26. QIAN Kangle, XU Jinbao, LV Zhongguang, et al. An additive manufactured diamond of surface for metal wire: CN2022322617470X [P]. 2023-09-26.
[13]	思瀚产业研究院. 金刚石线行业技术水平及技术特点[EB/OL]. (2022-10-14)[2023-11-25]. https://baijiahao.baidu.com/s?id=1746629777867388987&wfr=spider&for=pc. Sihan Industry Research Institute. Technical level and characteristics of diamond wire industry[EB/OL]. (2022-10-14)[2023-11-25]. https://baijiahao.baidu.com/s?id=1746629777867388987&wfr=spider&for=pc.
[14]	张景涛. 电镀金刚石线锯制造工艺及其性能的研究 [D]. 青岛: 青岛科技大学, 2013. ZHANG Jingtao. Research on manufacturing process and its performance of the electroplated diamond wire saw [D]. Qingdao: Qingdao University of Science & Technology, 2013.
[15]	TSUBOT T, TANII S, ISHIDA T, et al. Composite electroplating of Ni and surface-modified diamond particles with silane coupling regent [J]. Diamond and Related Materials,2005,14(3):605-612. doi: 10.1016/j.diamond.2005.01.013
[16]	GANESH V, VIJAGARAFHAVAN D, LSKSHMINARAYANAN V. Fine grain growth of nickel electrode-posit: Effect of applied magnetic field during deposition [J]. Applied Surface Science,2005,240(1):286-295. doi: 10.1016/j.apsusc.2004.06.139
[17]	付宇明, 王三星, 郑丽娟. 交变磁处理对金刚石锯片性能的影响 [J]. 金刚石与磨料磨具工程,2013(4):49-51. doi: 10.3969/j.issn.1006-852X.2008.06.008 FU Yuming, WANG Sanxing, ZHENG Lijuan. Effect of alternating magnetic treatment on the properties of diamond saw blades [J]. Diamond & Abrasives Engineering,2013(4):49-51. doi: 10.3969/j.issn.1006-852X.2008.06.008
[18]	MILLER P C. Look at magnetic treatment of tools and wear surface [J]. Tooling & Production,1990,55(12):100-103.
[19]	王琳, 赵汉雨, 李云东, 等. 制备电镀金刚石工具时外加交变磁场的作用 [J]. 电镀与环保,2012,32(3):11-13. doi: 10.3969/j.issn.1000-4742.2012.03.004 WANG Lin, ZHAO Hanyu, LI Yundong, et al. Effects of applied magnetic field in preparation of electroplated diamond tools [J]. Electroplating & Pollution Control,2012,32(3):11-13. doi: 10.3969/j.issn.1000-4742.2012.03.004
[20]	忘艳辉, 李晓虎, 常锐, 等. 金刚石微粉表面镀覆对线锯的关键作用分析 [J]. 金刚石与磨料磨具工程,2013,3(33):26-30. doi: 10.13394/j.cnki.jgszz.2013.03.015 WANG Yanhui, LI Xiaohu, CHANG Rui, et al. Effect of coated micro powder on diamond wire saw manufacturing technology [J]. Diamond & Abrasives Engineering,2013,3(33):26-30. doi: 10.13394/j.cnki.jgszz.2013.03.015
[21]	朱澍勋, 周星, 梁承渊, 等. 一种测评镀覆金刚石磁化率的装置: CN202122947683. X [P]. 2022-05-03. ZHU Shuxun, ZHOU Xing, LIANG Chengyuan, et al. An equipment for magnetic susceptibility of coated diamond: CN202122947683. X [P]. 2022-05-03.
[22]	全国稀土标准化技术委员会. 烧结钕铁硼永磁材料: GB/T 13560—2017[S]. 北京: 中国标准出版社, 2017. National Technical Committee for Standardization of Rare Earth. Sintered neodymium iron boron permanent magnets: GB/T 13560—2017[S]. Beijing: Standards Press of China, 2017.
[23]	全国磨粒磨具标准化技术委员会. 超硬磨料人造金刚石和立方氮化硼微粉: JB/T 7990—2012[S]. 北京: 机械工业出版社, 2012. National Technical Committee for Standardization of Abrasive Tools. Superabrasive: Synthetic diamond and cubic boron nitride micropowder: JB/T 7990—2012 [S]. Beijing: China Machine Press, 2012.
[24]	全国磨粒磨具标准化技术委员会. 超硬磨料制品电镀金刚石线: JB/T 12543—2015[S]. 北京: 机械工业出版社, 2016. National Technical Committee for Standardization of Abrasive Tools. Superabrasive products: Electroplated diamond wire: JB/T 12543—2015 [S]. Beijing: China Machine Press, 2016.
[25]	李相鹏, 舒健, 李芳霞, 等. 一种基于永磁体的旋转磁场产生装置: CN109036759B [P]. 2020-06-19. LI Xiangpeng, SHU Jian, LI Fangxia, et al. An equipment for rotating magnetic field basing on permanent magnets: CN109036759B [P]. 2020-06-19.
[26]	李宏达, 秦军存, 邢旭, 等. 线速度对金刚石线锯及硅片表面质量的影响 [J]. 金刚石与磨料磨具工程,2017,37(5):41-44,49. doi: 10.13394/j.cnki.jgszz.2017.5.0007 LI Hongda, QIN Juncun, XING Xu, et al. Influence of wire speed on diamond wire saw and surface quality of silicon wafer [J]. Diamond & Abrasives Engineering,2017,37(5):41-44,49. doi: 10.13394/j.cnki.jgszz.2017.5.0007