Citation: | HUANG Shuiquan, GAO Shang, HUANG Chuanzhen, HUANG Han. Nanoscale removal mechanisms in abrasive machining of brittle solids[J]. Diamond & Abrasives Engineering, 2022, 42(3): 257-267. doi: 10.13394/j.cnki.jgszz.2021.3009 |
[1] |
HUANG H, LI X, MU D, et al. Science and art of ductile grinding of brittle solids [J]. International Journal of Machine Tools and Manufacture,2020,161:103675. doi: 10.1016/j.ijmachtools.2020.103675
|
[2] |
LAWN B R, BORRERO-LOPEZ O, HUANG H, et al. Micromechanics of machining and wear in hard and brittle materials [J]. Journal of the American Ceramic Society,2020,104(1):5-22. doi: 10.1111/jace.17502
|
[3] |
WU Y, MU D, HUANG H. Deformation and removal of semiconductor and laser single crystals at extremely small scales [J]. International Journal of Extreme Manufacturing,2020,2(2):12006. doi: 10.1088/2631-7990/ab7a2a
|
[4] |
SREEJITH P S, NGOI B K A. Material removal mechanisms in precision machining of new materials [J]. International Journal of Machine Tools and Manufacture,2001,41(12):1831-1843. doi: 10.1016/S0890-6955(01)00014-1
|
[5] |
PEI Z J, FISHER G R, LIU J. Grinding of silicon wafers: A review from historical perspectives [J]. International Journal of Machine Tools and Manufacture,2008,48(12/13):1297-1307. doi: 10.1016/j.ijmachtools.2008.05.009
|
[6] |
FENG P, WANG J, ZHANG J, et al. Damage formation and suppression in rotary ultrasonic machining of hard and brittle materials: A critical review [J]. Ceramics International,2017,44:1227-1239. doi: 10.1016/j.ceramint.2017.10.050
|
[7] |
YAN J, ZHANG Z, KURIYAGAWA T. Mechanism for material removal in diamond turning of reaction-bonded silicon carbide [J]. International Journal of Machine Tools and Manufacture,2009,49(5):366-374. doi: 10.1016/j.ijmachtools.2008.12.007
|
[8] |
MUKAIDA M, YAN J. Ductile machining of single-crystal silicon for microlens arrays by ultraprecision diamond turning using a slow tool servo [J]. International Journal of Machine Tools and Manufacture,2017,115:2-14. doi: 10.1016/j.ijmachtools.2016.11.004
|
[9] |
LI C, LI X, WU Y, et al. Deformation mechanism and force modelling of the grinding of YAG single crystals [J]. International Journal of Machine Tools and Manufacture,2019,143:23-37. doi: 10.1016/j.ijmachtools.2019.05.003
|
[10] |
LI C, WU Y, LI X, et al. Deformation characteristics and surface generation modelling of crack-free grinding of GGG single crystals [J]. Journal of Materials Processing Technology,2020,279:116577. doi: 10.1016/j.jmatprotec.2019.116577
|
[11] |
ZHANG C, RENTS |