CN 41-1243/TG ISSN 1006-852X
Volume 42 Issue 3
Jul.  2022
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Article Contents
HUANG Shuiquan, GAO Shang, HUANG Chuanzhen, HUANG Han. Nanoscale removal mechanisms in abrasive machining of brittle solids[J]. Diamond & Abrasives Engineering, 2022, 42(3): 257-267. doi: 10.13394/j.cnki.jgszz.2021.3009
Citation: HUANG Shuiquan, GAO Shang, HUANG Chuanzhen, HUANG Han. Nanoscale removal mechanisms in abrasive machining of brittle solids[J]. Diamond & Abrasives Engineering, 2022, 42(3): 257-267. doi: 10.13394/j.cnki.jgszz.2021.3009

Nanoscale removal mechanisms in abrasive machining of brittle solids

doi: 10.13394/j.cnki.jgszz.2021.3009
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  • Received Date: 2022-04-23
  • Accepted Date: 2022-05-20
  • Rev Recd Date: 2022-05-14
  • Available Online: 2022-07-13
  • Brittle solids with dominant covalent-ionic bonding, including single crystals, polycrystals, and optical glass, are core materials for modern microelectronic and optoelectronic devices that are widely used in energy, communication, transportation, and medicine sectors. In high performance device applications, those brittle materials must be machined into parts that often have an extremely smooth surface and a damage-free subsurface with sub-micron precision. Optimisation of an abrasive machining process for the brittle solids can significantly enhance production efficiency and reduce manufacturing cost, as well as prolong device life. The development of high efficiency and low damage ultraprecision shaping technologies for this class of solids requires an in-depth understanding of their deformation and removal mechanisms at nanoscale. In this work, the fundamental mechanisms of deformation and removal of brittle materials involved in individual or cumulative contacts with blunt and sharp grits are analysed, using the scratch-related micromechanics as the theoretical basis. Essentials of brittle-to-ductile transitions in abrasive machining are outlined. Influence of the diversity in material microstructures in determining local deformation and subsequent removal is highlighted. Practical requirements are suggested for further advancing ultraprecision abrasive machining of those brittle solids.

     

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  • [1]
    HUANG H, LI X, MU D, et al. Science and art of ductile grinding of brittle solids [J]. International Journal of Machine Tools and Manufacture,2020,161:103675. doi: 10.1016/j.ijmachtools.2020.103675
    [2]
    LAWN B R, BORRERO-LOPEZ O, HUANG H, et al. Micromechanics of machining and wear in hard and brittle materials [J]. Journal of the American Ceramic Society,2020,104(1):5-22. doi: 10.1111/jace.17502
    [3]
    WU Y, MU D, HUANG H. Deformation and removal of semiconductor and laser single crystals at extremely small scales [J]. International Journal of Extreme Manufacturing,2020,2(2):12006. doi: 10.1088/2631-7990/ab7a2a
    [4]
    SREEJITH P S, NGOI B K A. Material removal mechanisms in precision machining of new materials [J]. International Journal of Machine Tools and Manufacture,2001,41(12):1831-1843. doi: 10.1016/S0890-6955(01)00014-1
    [5]
    PEI Z J, FISHER G R, LIU J. Grinding of silicon wafers: A review from historical perspectives [J]. International Journal of Machine Tools and Manufacture,2008,48(12/13):1297-1307. doi: 10.1016/j.ijmachtools.2008.05.009
    [6]
    FENG P, WANG J, ZHANG J, et al. Damage formation and suppression in rotary ultrasonic machining of hard and brittle materials: A critical review [J]. Ceramics International,2017,44:1227-1239. doi: 10.1016/j.ceramint.2017.10.050
    [7]
    YAN J, ZHANG Z, KURIYAGAWA T. Mechanism for material removal in diamond turning of reaction-bonded silicon carbide [J]. International Journal of Machine Tools and Manufacture,2009,49(5):366-374. doi: 10.1016/j.ijmachtools.2008.12.007
    [8]
    MUKAIDA M, YAN J. Ductile machining of single-crystal silicon for microlens arrays by ultraprecision diamond turning using a slow tool servo [J]. International Journal of Machine Tools and Manufacture,2017,115:2-14. doi: 10.1016/j.ijmachtools.2016.11.004
    [9]
    LI C, LI X, WU Y, et al. Deformation mechanism and force modelling of the grinding of YAG single crystals [J]. International Journal of Machine Tools and Manufacture,2019,143:23-37. doi: 10.1016/j.ijmachtools.2019.05.003
    [10]
    LI C, WU Y, LI X, et al. Deformation characteristics and surface generation modelling of crack-free grinding of GGG single crystals [J]. Journal of Materials Processing Technology,2020,279:116577. doi: 10.1016/j.jmatprotec.2019.116577
    [11]
    ZHANG C, RENTS