CN 41-1243/TG ISSN 1006-852X
Volume 44 Issue 3
Jun.  2024
Turn off MathJax
Article Contents
WEN Jiazhou, WANG Qingxia, YU Aiwu, WU Chongjun. Removal mechanism of unidirectional Cf/SiC composites based on single diamond grit scratching[J]. Diamond & Abrasives Engineering, 2024, 44(3): 327-334. doi: 10.13394/j.cnki.jgszz.2023.0104
Citation: WEN Jiazhou, WANG Qingxia, YU Aiwu, WU Chongjun. Removal mechanism of unidirectional Cf/SiC composites based on single diamond grit scratching[J]. Diamond & Abrasives Engineering, 2024, 44(3): 327-334. doi: 10.13394/j.cnki.jgszz.2023.0104

Removal mechanism of unidirectional Cf/SiC composites based on single diamond grit scratching

doi: 10.13394/j.cnki.jgszz.2023.0104
More Information
  • Received Date: 2023-05-07
  • Accepted Date: 2023-08-29
  • Rev Recd Date: 2023-07-11
  • Available Online: 2024-06-28
  • To investigate the scratch removal mechanism of unidirectional Cf/SiC composite materials, quasi-static scratching tests were carried out using a single diamond abrasive grain to analyze the changes in acoustic emission signals of the scratched materials under different indentation loads. These tests were complemented by SEM images to analyze the removal behavior and scratch removal mechanism of the materials. The test results show that the acoustic emission signal value increases with the increase in indentation load. Under the same parameters, the signal value in the SB direction is larger, and the signal fluctuation is more severe. Combining the acoustic emission signal and SEM morphology analysis, it is concluded that the scratch removal behavior of the material varies in different directions. The material primarily undergoes brittle removal. In the SA direction, fibers mainly experience tensile fracture and fiber pull-out, whereas in the SB direction, the main fracture modes of the fiber are bending fracture and shear fracture. According to the SEM morphology analysis, the formation process of the removal behavior and the material scratch removal mechanism are described.

     

  • loading
  • [1]
    张梦航, 段俊杰, 王晶晶, 等. 碳纤维增韧陶瓷基摩擦材料的研究现状、挑战与展望 [J]. 硅酸盐学报,2021,49(9):1878-1897. doi: 10.14062/j.issn.0454-5648.20200838

    ZHANG Menghang, DUAN Junjie, WANG Jingjing, et al. Research status, challenges and prospects of high-performance carbon fiber reinforced [J]. Journal of the Chinese Ceramic Society,2021,49(9):1878-1897. doi: 10.14062/j.issn.0454-5648.20200838
    [2]
    卢守相, 郭塞, 张建秋, 等. 高性能难加工材料可磨削性研究进展 [J]. 表面技术,2022,51(3):12-42. doi: 10.16490/j.cnki.issn.1001-3660.2022.03.002

    LU Shouxiang, GUO Sai, ZHANG Jianqiu, et al. Grindability of high performance difficult-to-machine materials [J]. Surface Technology,2022,51(3):12-42. doi: 10.16490/j.cnki.issn.1001-3660.2022.03.002
    [3]
    王晓博, 李璐璐, 赵波, 等. 陶瓷基复合材料加工技术及其表面亚表面损伤机制研究进展 [J]. 表面技术,2021,50(12):17-34. doi: 10.16490/j.cnki.issn.1001-3660.2021.12.002

    WANG Xiaobo, LI Lulu, ZHAO Bo, et al. Research progress on processing technology and surface and subsurface damage mechanism of ceramic matrix composites [J]. Surface Technology,2021,50(12):17-34. doi: 10.16490/j.cnki.issn.1001-3660.2021.12.002
    [4]
    DIAZ O G, LUNA G G, LIAO Z, et al. The new challenges of machining ceramic matrix composites (CMCs): Review of surface integrity [J]. International Journal of Machine Tools and Manufacture,2019,139:24-36. doi: 10.1016/j.ijmachtools.2019.01.003
    [5]
    王涛, 王盛, 乔伟林, 等. 单向C/SiC复合材料平面磨削的磨削力模型研究 [J]. 中国机械工程,2019,30(17):2017-2021. doi: 10.3969/j.issn.1004-132X.2019.17.001

    WANG Tao, WANG Sheng, QIAO Weilin, et al. Research on grinding force model of plane grinding for unidirectional C/SiC composites [J]. China Mechanical Engineering,2019,30(17):2017-2021. doi: 10.3969/j.issn.1004-132X.2019.17.001
    [6]
    QU S, GONG Y, YANG Y, et al. Mechanical model and removal mechanism of unidirectional carbon fiber-reinforced ceramic composites [J]. International Journal of Mechanical Sciences,2020,173:105465. doi: 10.1016/j.ijmecsci.2020.105465
    [7]
    LUNA G G, DRAGOS A, NOVOVIC D. Influence of grit geometry and fiber orientation on the abrasive material removal mechanisms of SiC/SiC ceramic matrix composites (CMCs) [J]. International Journal of Machine Tools and Manufacture,2020,157(9/10/11/12):103580. doi: 10.1016/j.ijmachtools.2020.103580
    [8]
    LIU Y, QUAN Y, WU C, et al. Single diamond scribing of SiCf/SiC composite: force and material removal mechanism study [J]. Ceramics International,2021,47(19):27702-27709. doi: 10.1016/j.ceramint.2021.06.195
    [9]
    ZHANG Z, YUAN S, XU W, et al. Damage behavior and removal mechanism of different yarn orientations 2.5D SiCf/SiC composites under single-abrasive scratch test [J]. Ceramics International,2022,48(20):30868-30883. doi: 10.1016/j.ceramint.2022.07.041
    [10]
    LI Y, XIANG G, HUI Y, et al. Study of material removal mechanisms in grinding of C/SiC composites via single-abrasive scratch tests [J]. Ceramics International,2019,45(4):4729-4738. doi: 10.1016/j.ceramint.2018.11.165
    [11]
    GAO T, LI C, YANG M, et al. Mechanics analysis and predictive force models for the single-diamond grain grinding of carbon fiber reinforced polymers using CNT nano-lubricant [J]. Journal of Materials Processing Technology,2021,290:116976. doi: 10.1016/j.jmatprotec.2020.116976
    [12]
    SANCHEZ L, OLIVEIRA J, COELHO R T. Detection of cracks in scratching tests in ceramic materials through acoustic emission [J]. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture,2005,219(9):685-693. doi: 10.1243/095440505X32616
    [13]
    邹芹, 周鑫, 李艳国, 等. SiC复合材料的研究进展与展望 [J]. 中南大学学报(自然科学版),2020,51(11):3220-3232. doi: 10.11817/j.issn.1672-7207.2020.11.025

    ZOU Qin, ZHOU Xin, LI Yanguo, et al. Research progress and prospect of SiC composites [J]. Journal of Central South University(Science and Technology),2020,51(11):3220-3232. doi: 10.11817/j.issn.1672-7207.2020.11.025
    [14]
    ZHANG L, WANG S, LI Z, et al. Influence factors on grinding force in surface grinding of unidirectional C/SiC composites [J]. Applied Composite Materials,2019,26(3):1073-1085. doi: 10.1007/s10443-019-09767-5
    [15]
    WU C, DONG W, ZHU L, et al. Modeling of grinding chip thickness distribution based on material removel mode in grinding of SiC ceramics [J]. Journal of Advanced Mechanical Design, Systems, and Manufacturing,2020,14(1):JAMDSM0018. doi: 10.1299/jamdsm.2020jamdsm0018
    [16]
    陈明, 徐锦泱, 安庆龙. 碳纤维复合材料与叠层结构切削加工理论及应用技术 [M]. 上海: 上海科学技术出版社, 2019: 68-105.

    CHEN Ming, XU Jinyang, AN Qinglong. Theory and application technology of cutting and processing of carbon fiber composites and laminated structures [M]. Shanghai: Shanghai Scientific & Technical Publishers, 2019: 68-105.
  • 加载中

Catalog

    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索

    Figures(8)  / Tables(1)

    Article Metrics

    Article views (33) PDF downloads(16) Cited by()
    Proportional views
    Related

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return